Sputter Source "Ultra High Vacuum Compatible Magnetron RF Sputter Source"
It is possible to remove the magnet while maintaining the spatter source in ultra-high vacuum.
The "Ultra High Vacuum Compatible Magnetron RF Sputter Source" is a general-purpose compact magnetron sputter source compatible with ultra high vacuum. Since the entire body is bakeable, it enables film deposition with minimal impurities even with highly reactive targets. 【Features】 - Ultra high vacuum type that does not use O-rings - The magnet can be removed while maintaining the sputter source in ultra high vacuum - Baking up to 300°C is possible by removing the magnet - Target fixation is done with a retainer, allowing for quick target replacement - The gas inlet is integrated with the mounting flange, eliminating the need for a separate flange for gas introduction For more details, please contact us or download the catalog.
- 企業：北野精機
- 価格：Other
